Wafer Level Chip Size Package (WLCSP) Michael 2018-03-12 22:55 A20180311013 進階 點閱 393 留言 0 E 0 T 0 免費 進階 點閱 393 留言 0 E 0 T 0 Integrated circuit (IC) packaging is conducted in a packaging company. But there is a new packaging technology that is conducted in a foundry to be directly applied on the wafer, so-called WLCSP. (共同作者：Hightech)
